Delock PCIe x4 card > 1 x internal NVMe M.2 Key M 110 mm
PCI Express x4 card > 1 x internal NVMe M.2 Key M 110 mm with heatsink - low profile form factor
Brand: Delock
SKU: 89577
$83.88
Price as listed. Shipping charges calculated at checkout.
In stock
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NOTE: The information below is provided for your convenience only; the accuracy of the specifications cannot be guaranteed. However, if necessary, please check with us before purchasing. Data provided by 1 World Sync.
General
Host interface
PCIe
Output interface
M.2
Expansion card standard
PCIe 3.0
Product colour
Black,Red,Silver
Data transfer rate (max)
39 Gbit/s
Windows operating systems supported
Windows 10 Education,Windows 10 Education x64,Windows 10 Enterprise,Windows 10 Enterprise x64,Windows 10 Home,Windows 10 Home x64,Windows 10 IOT Core,Windows 10 Pro,Windows 10 Pro x64,Windows 7 Enterprise,Windows 7 Enterprise x64,Windows 7 Home Basic,Windows 7 Home Basic x64,Windows 7 Home Premium,Windows 7 Home Premium x64,Windows 7 Professional,Windows 7 Professional x64,Windows 7 Starter,Windows 7 Starter x64,Windows 7 Ultimate,Windows 7 Ultimate x64,Windows 8,Windows 8.1
Package type
Box
DeLOCK 89577. Host interface: PCIe, Output interface: M.2, Expansion card standard: PCIe 3.0. Product colour: Black,Red,Silver. Data transfer rate (max): 39 Gbit/s. Windows operating systems supported: Windows 10 Education,Windows 10 Education x64,Windows 10 Enterprise,Windows 10 Enterprise.... Package type: Box
| Estimate Gross Weight | 0.166 |
|---|
https://www.delock.de/produkte/G_89577/merkmale.html
This PCI Express card by Delock expands the PC by one M.2 slot. An M.2 SSD in format 22110, 2280, 2260 and 2242 can be connected. By the heat sink, which can be positioned on different applicable positions, can be ensured a good heat dissipation of the memory module.
This PCI Express card by Delock expands the PC by one M.2 slot. An M.2 SSD in format 22110, 2280, 2260 and 2242 can be connected. By the heat sink, which can be positioned on different applicable positions, can be ensured a good heat dissipation of the memory module.
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